BC846B,235 vs BC846B feature comparison

BC846B,235 NXP Semiconductors

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BC846B Kodenshi Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS KODENSHI AUK CORP
Part Package Code TO-236
Package Description PLASTIC, SMD, 3 PIN
Pin Count 3
Manufacturer Package Code SOT23
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 65 V 55 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 200 200
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.5 W 0.2 W
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 150 MHz
VCEsat-Max 0.6 V
Base Number Matches 2 44

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