BC817-25,235 vs BC817,235 feature comparison

BC817-25,235 NXP Semiconductors

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BC817,235 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TO-236 TO-236
Package Description PLASTIC PACKAGE-3 PLASTIC PACKAGE-3
Pin Count 3 3
Manufacturer Package Code SOT23 SOT23
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Factory Lead Time 4 Weeks 4 Weeks
Collector Current-Max (IC) 0.5 A 0.5 A
Collector-Base Capacitance-Max 3 pF
Collector-Emitter Voltage-Max 45 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 160 100
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.25 W 0.3 W
Qualification Status Not Qualified Not Qualified
Reference Standard IEC-60134
Surface Mount YES YES
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.7 V 0.7 V
Base Number Matches 2 2
Moisture Sensitivity Level 1

Compare BC817-25,235 with alternatives

Compare BC817,235 with alternatives