BC817,235
vs
BC817-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
GALAXY SEMI-CONDUCTOR CO LTD
Part Package Code
TO-236
Package Description
PLASTIC PACKAGE-3
SMALL OUTLINE, R-PDSO-G3
Pin Count
3
Manufacturer Package Code
SOT23
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Collector Current-Max (IC)
0.5 A
0.5 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
100
100
JEDEC-95 Code
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.3 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Transistor Application
SWITCHING
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
170 MHz
VCEsat-Max
0.7 V
Base Number Matches
2
46
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