BB215TRL vs BB181,335 feature comparison

BB215TRL YAGEO Corporation

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BB181,335 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description O-LELF-R2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00
Breakdown Voltage-Min 30 V
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Capacitance Ratio-Min 7.6 12
Diode Element Material SILICON
Diode Type VARIABLE CAPACITANCE DIODE VARIABLE CAPACITANCE DIODE
Frequency Band VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 Code O-LELF-R2
Number of Elements 1 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Form WRAP AROUND
Terminal Position END
Variable Capacitance Diode Classification ABRUPT ABRUPT
Base Number Matches 2 1
Rohs Code Yes
Part Package Code SOD
Pin Count 2
Manufacturer Package Code SOD523
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Diode Capacitance-Nom 12.5 pF
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Rep Pk Reverse Voltage-Max 30 V
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

Compare BB215TRL with alternatives

Compare BB181,335 with alternatives