BB135,115
vs
1T399
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
SONY CORP
Part Package Code
SOD
Package Description
PLASTIC, SMD, 2 PIN
R-PDSO-G2
Pin Count
2
2
Manufacturer Package Code
SOD323
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00
8541.10.00.80
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Configuration
SINGLE
SINGLE
Diode Capacitance Ratio-Min
8.9
11
Diode Capacitance-Nom
19.25 pF
32.5 pF
Diode Element Material
SILICON
SILICON
Diode Type
VARIABLE CAPACITANCE DIODE
VARIABLE CAPACITANCE DIODE
Frequency Band
ULTRA HIGH FREQUENCY
JESD-30 Code
R-PDSO-G2
R-PDSO-G2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
30 V
34 V
Reverse Current-Max
0.01 µA
Reverse Test Voltage
30 V
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Variable Capacitance Diode Classification
ABRUPT
ABRUPT
Base Number Matches
1
1
Breakdown Voltage-Min
34 V
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