BAW56W-7 vs BAW56M,315 feature comparison

BAW56W-7 Diodes Incorporated

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BAW56M,315 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Package Description ULTRA SMALL, PLASTIC PACKAGE-3 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
Pin Count 3 3
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Application GENERAL PURPOSE
Configuration COMMON ANODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.715 V 0.001 V
JESD-30 Code R-PDSO-G3 R-PBCC-N3
JESD-609 Code e0 e3
Moisture Sensitivity Level 1 1
Non-rep Pk Forward Current-Max 2 A 4 A
Number of Elements 2 2
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C
Output Current-Max 0.15 A 0.15 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER
Power Dissipation-Max 0.2 W 0.25 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 75 V 90 V
Reverse Recovery Time-Max 0.004 µs 0.004 µs
Surface Mount YES YES
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING NO LEAD
Terminal Position DUAL BOTTOM
Base Number Matches 2 1
Part Package Code DFN
Manufacturer Package Code SOT883
Case Connection ANODE
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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