BAW56M,315
vs
BAW56WT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
YANGZHOU YANGJIE ELECTRONICS CO LTD
Part Package Code
DFN
Package Description
1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
Pin Count
3
Manufacturer Package Code
SOT883
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Case Connection
ANODE
Configuration
COMMON ANODE, 2 ELEMENTS
COMMON ANODE, 2 ELEMENTS
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.001 V
JESD-30 Code
R-PBCC-N3
R-PDSO-G3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
4 A
Number of Elements
2
2
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Output Current-Max
0.15 A
0.15 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Dissipation-Max
0.25 W
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
90 V
100 V
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Finish
TIN
Terminal Form
NO LEAD
GULL WING
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Base Number Matches
2
2
Application
GENERAL PURPOSE
Operating Temperature-Min
-55 °C
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