BAV102/T3
vs
BAV102,115
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Date Of Intro
2017-02-01
Application
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Power Dissipation-Max
0.4 W
0.4 W
Reference Standard
IEC-60134
Rep Pk Reverse Voltage-Max
200 V
200 V
Reverse Recovery Time-Max
0.05 µs
0.05 µs
Surface Mount
YES
YES
Terminal Finish
TIN
TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
2
Part Package Code
MELF
Pin Count
2
Manufacturer Package Code
SOD80C
HTS Code
8541.10.00.80
Factory Lead Time
4 Weeks
Forward Voltage-Max (VF)
1.25 V
Non-rep Pk Forward Current-Max
5 A
Output Current-Max
0.25 A
Qualification Status
Not Qualified
Reverse Current-Max
0.1 µA
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