BAV102,115
vs
BAV102-GS08
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEFUNKEN MICROELECTRONICS GMBH
|
Part Package Code |
MELF
|
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD80C
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
|
Factory Lead Time |
4 Weeks
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.25 V
|
1 V
|
JESD-30 Code |
O-LELF-R2
|
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
5 A
|
1 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Output Current-Max |
0.25 A
|
0.25 A
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.4 W
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
Reverse Current-Max |
0.1 µA
|
|
Reverse Recovery Time-Max |
0.05 µs
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WRAP AROUND
|
|
Terminal Position |
END
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
3
|
Application |
|
GENERAL PURPOSE
|
|
|
|
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