BAT54L,315
vs
BAT54L
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
GALAXY SEMI-CONDUCTOR CO LTD
Part Package Code
DFN
Package Description
1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, PLASTIC PACKAGE-2
R-PBCC-N2
Pin Count
2
Manufacturer Package Code
SOD882
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Factory Lead Time
4 Weeks
Application
GENERAL PURPOSE
FAST RECOVERY
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.24 V
1 V
JESD-30 Code
R-PBCC-N2
R-PBCC-N2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
0.6 A
0.6 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
125 °C
Output Current-Max
0.2 A
0.2 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Dissipation-Max
0.25 W
0.2 W
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
30 V
30 V
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Finish
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Base Number Matches
2
6
Breakdown Voltage-Min
30 V
Operating Temperature-Min
-65 °C
Reverse Current-Max
2 µA
Reverse Recovery Time-Max
0.005 µs
Reverse Test Voltage
25 V
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