BAT17T/R
vs
MMBD301LT1G
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
Part Package Code |
SOT-23
|
SOT-23 (TO-236) 3 LEAD
|
Package Description |
PLASTIC, SMD, 3 PIN
|
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 318-08, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.60
|
8541.10.00.60
|
Breakdown Voltage-Min |
4 V
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
1 pF
|
1.5 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
Forward Voltage-Max (VF) |
0.6 V
|
|
Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
JEDEC-95 Code |
TO-236AB
|
TO-236
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Noise Figure-Max |
8 dB
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
100 °C
|
125 °C
|
Output Current-Max |
30 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Current-Max |
0.25 µA
|
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
318-08
|
Factory Lead Time |
|
10 Weeks
|
Samacsys Manufacturer |
|
onsemi
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Min |
|
-55 °C
|
Power Dissipation-Max |
|
0.2 W
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAT17T/R with alternatives
Compare MMBD301LT1G with alternatives