BAS70E3 vs BAS70,235 feature comparison

BAS70E3 Microsemi Corporation

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BAS70,235 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Package Description PLASTIC, SOT-23, 3 PIN PLASTIC PACKAGE-3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
kg CO2e/kg 8.8
Average Weight (mg) 10.2
CO2e (mg) 89.76
Category CO2 Kg 8.8 8.8
Candidate List Date 2017-07-07 2022-06-10
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V5.10 CMRT V4.20
Application GENERAL PURPOSE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 3 3
Output Current-Max 0.2 A 0.07 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation-Max 0.2 W
Reverse Recovery Time-Max 0.005 µs
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 2
Rohs Code Yes
parentfamilyid 1074342
Part Package Code TO-236
Pin Count 3
Manufacturer Package Code SOT23
Factory Lead Time 4 Weeks
Total Weight 7.48
CO2 65.82400000000001
EU RoHS Version RoHS 2 (2015/863/EU)
CAS Accounted for Wt 94
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7440-48-4, 7440-02-0, 1333-86-4
EFUP e
Forward Voltage-Max (VF) 0.41 V
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 0.1 A
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 70 V
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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