BAP65-02,115
vs
BAP65-02,135
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOD
|
SOD
|
Package Description |
ULTRA SMALL, PLASTIC, SC-79, 2 PIN
|
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
SOD523
|
SOD523
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00
|
8541.10.00
|
Factory Lead Time |
13 Weeks
|
13 Weeks
|
Samacsys Manufacturer |
NXP
|
NXP
|
Additional Feature |
HIGH VOLTAGE
|
|
Application |
ATTENUATOR; SWITCHING
|
|
Breakdown Voltage-Min |
30 V
|
30 V
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
0.9 pF
|
0.9 pF
|
Diode Capacitance-Nom |
0.65 pF
|
0.65 pF
|
Diode Element Material |
SILICON
|
|
Diode Forward Resistance-Max |
0.9 Ω
|
0.9 Ω
|
Diode Res Test Current |
5 mA
|
5 mA
|
Diode Res Test Frequency |
100 MHz
|
100 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-30 Code |
R-PDSO-F2
|
|
JESD-609 Code |
e3
|
e3
|
Minority Carrier Lifetime-Nom |
0.17 µs
|
0.17 µs
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.715 W
|
|
Qualification Status |
Not Qualified
|
|
Reverse Test Voltage |
|
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
FLAT
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BAP65-02,115 with alternatives
Compare BAP65-02,135 with alternatives