B250S vs S1ZB60-4062 feature comparison

B250S Diotec Semiconductor AG

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S1ZB60-4062 Shindengen Electronic Manufacturing Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer DIOTEC SEMICONDUCTOR AG SHINDENGEN ELECTRIC MANUFACTURING CO LTD
Part Package Code DIP
Package Description DIP-4 R-XDIP-T4
Pin Count 4
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.70
Additional Feature UL RECOGNIZED
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1.05 V
JESD-30 Code R-PDSO-G4 R-XDIP-T4
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 50 A 30 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -50 °C
Output Current-Max 1 A 0.5 A
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Reference Standard UL RECOGNIZED
Rep Pk Reverse Voltage-Max 600 V 600 V
Reverse Current-Max 5 µA 0.00001 µA
Reverse Recovery Time-Max 1.5 µs
Reverse Test Voltage 600 V
Surface Mount YES NO
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Breakdown Voltage-Min 600 V
JESD-609 Code e6
Terminal Finish TIN BISMUTH

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