AXDA2200DUV3C
vs
AXDA2700DKV3D
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
PGA, SPGA453,37X37
|
PGA, SPGA453,37X37
|
| Pin Count |
453
|
453
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.1
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
13
|
13
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
166 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CPGA-P453
|
S-CPGA-P453
|
| Length |
49.525 mm
|
49.525 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
453
|
453
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Equivalence Code |
SPGA453,37X37
|
SPGA453,37X37
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
1800 MHz
|
2167 MHz
|
| Supply Current-Max |
41200 mA
|
41400 mA
|
| Supply Voltage-Max |
1.65 V
|
1.7 V
|
| Supply Voltage-Min |
1.55 V
|
1.6 V
|
| Supply Voltage-Nom |
1.6 V
|
1.65 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
49.525 mm
|
49.525 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare AXDA2200DUV3C with alternatives
Compare AXDA2700DKV3D with alternatives