AX500-2FG484I
vs
AX500-1FG484
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA, BGA484,22X22,40
1 MM PITCH, FBGA-484
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
500000 SYSTEM GATES AVAILABLE
500000 SYSTEM GATES AVAILABLE
Clock Frequency-Max
870 MHz
763 MHz
Combinatorial Delay of a CLB-Max
0.74 ns
0.84 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
5376
5376
Number of Equivalent Gates
500000
500000
Number of Inputs
336
336
Number of Logic Cells
8064
8064
Number of Outputs
336
336
Number of Terminals
484
484
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
5376 CLBS, 500000 GATES
5376 CLBS, 500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
3
Factory Lead Time
8 Weeks
Packing Method
TRAY
Compare AX500-2FG484I with alternatives
Compare AX500-1FG484 with alternatives