AX1000-3FGG676I vs AX1000-1FGG676M feature comparison

AX1000-3FGG676I Microsemi Corporation

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AX1000-1FGG676M Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 1 MM PITCH, ROHS COMPLIANT, FBGA-676
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1000000 SYSTEM GATES AVAILABLE 1000000 SYSTEM GATES AVAILABLE
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 612000 1000000
Number of Terminals 676 676
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 612000 GATES 12096 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Clock Frequency-Max 763 MHz
Combinatorial Delay of a CLB-Max 0.84 ns
Number of CLBs 12096
Number of Inputs 516
Number of Logic Cells 18144
Number of Outputs 516
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) 30

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