AU5517D
vs
NE5517DR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Part Package Code
SOIC
SOIC 16 LEAD
Package Description
SOP, SOP16,.25
SOIC-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
TRANSCONDUCTANCE
TRANSCONDUCTANCE
Average Bias Current-Max (IIB)
8 µA
8 µA
Bias Current-Max (IIB) @25C
5 µA
5 µA
Common-mode Reject Ratio-Nom
110 dB
110 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5000 µV
5000 µV
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
9.9 mm
Low-Offset
NO
NO
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-22 V
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Slew Rate-Nom
50 V/us
50 V/us
Supply Current-Max
4 mA
4 mA
Supply Voltage Limit-Max
22 V
22 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
751B-05
Factory Lead Time
11 Weeks
Samacsys Manufacturer
onsemi
JESD-609 Code
e3
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Unity Gain BW-Nom
2000
Compare AU5517D with alternatives
Compare NE5517DR2G with alternatives