AU1000266MCI vs IBM25NPE405L-3DA266CZ feature comparison

AU1000266MCI AMD

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IBM25NPE405L-3DA266CZ IBM

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer ADVANCED MICRO DEVICES INC IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description LBGA, BGA324,22X22,40 BGA, BGA324,22X22,40
Pin Count 324 324
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 12
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 15 MHz 66.6 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
Length 23 mm 23 mm
Low Power Mode YES YES
Number of Terminals 324 324
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA324,22X22,40 BGA324,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 1.6 V 2.7 V
Supply Voltage-Min 1.4 V 2.3 V
Supply Voltage-Nom 1.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
ECCN Code 3A991.A.2
JESD-609 Code e0
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)

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Compare IBM25NPE405L-3DA266CZ with alternatives