IBM25NPE405L-3DA266CZ
vs
4450HA/3
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
IBM MICROELECTRONICS
|
EXAR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA324,22X22,40
|
HBGA,
|
| Pin Count |
324
|
324
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
12
|
14
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.6 MHz
|
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e0
|
e0
|
| Length |
23 mm
|
19 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HBGA
|
| Package Equivalence Code |
BGA324,22X22,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
266 MHz
|
200 MHz
|
| Supply Voltage-Max |
2.7 V
|
1.03 V
|
| Supply Voltage-Min |
2.3 V
|
0.97 V
|
| Supply Voltage-Nom |
2.5 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
4
|
| Seated Height-Max |
|
2 mm
|
|
|
|
Compare IBM25NPE405L-3DA266CZ with alternatives
Compare 4450HA/3 with alternatives