ATTL7583AAJ-D
vs
ATTL7583BAJ-DT
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
MICROSEMI CORP
|
Package Description |
SOP,
|
SOP,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e0
|
|
Length |
17.9 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
2.67 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
28
|
|
|
|
Compare ATTL7583AAJ-D with alternatives
Compare ATTL7583BAJ-DT with alternatives