ATT1765P8 vs XC1765DPD8C feature comparison

ATT1765P8 LSI Corporation

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XC1765DPD8C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LUCENT TECHNOLOGIES INC XILINX INC
Package Description DIP, DIP8,.3 PLASTIC, DIP-8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 450 ns
Additional Feature SIMPLE 4-WIRE INTERFACE
Clock Frequency-Max (fCLK) 2.5 MHz 5 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Memory Density 16384 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 2000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A 0.0015 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 8
Length 9.3599 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.5974 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

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Compare XC1765DPD8C with alternatives