ATT17128AG8I-D vs XC1765ELVOG8I feature comparison

ATT17128AG8I-D LSI Corporation

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XC1765ELVOG8I AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LUCENT TECHNOLOGIES INC XILINX INC
Package Description SOP, TSOP2,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 450 ns
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Memory Density 524288 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX8 64KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL SERIAL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.075 mA
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code Yes
Part Package Code TSOP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code e3
Length 4.9276 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1938 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.937 mm

Compare ATT17128AG8I-D with alternatives

Compare XC1765ELVOG8I with alternatives