XC1765ELVOG8I
vs
MPA17128DI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
MOTOROLA INC
Part Package Code
TSOP
SOIC
Package Description
TSOP2,
SOP,
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
Length
4.9276 mm
4.9 mm
Memory Density
65536 bit
131072 bit
Memory IC Type
CONFIGURATION MEMORY
OTP ROM
Memory Width
1
1
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
131072 words
Number of Words Code
64000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX1
128KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1938 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.937 mm
3.9 mm
Base Number Matches
1
2
Output Characteristics
3-STATE
Compare XC1765ELVOG8I with alternatives
Compare MPA17128DI with alternatives