XC1765ELVOG8I vs MPA17128DI feature comparison

XC1765ELVOG8I AMD Xilinx

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MPA17128DI Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC MOTOROLA INC
Part Package Code TSOP SOIC
Package Description TSOP2, SOP,
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3
Length 4.9276 mm 4.9 mm
Memory Density 65536 bit 131072 bit
Memory IC Type CONFIGURATION MEMORY OTP ROM
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX1 128KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1938 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.937 mm 3.9 mm
Base Number Matches 1 2
Output Characteristics 3-STATE

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