ATSAMV70Q20B-CBTVAO
vs
ATSAMV70Q20B-AABT
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
LFBGA-144
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| CPU Family |
CORTEX-M7
|
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
16
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B144
|
|
| Length |
10 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
24
|
|
| Number of External Interrupts |
1
|
|
| Number of I/O Lines |
114
|
|
| Number of Serial I/Os |
8
|
|
| Number of Terminals |
144
|
|
| Number of Timers |
12
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA144,12X12,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| RAM (bytes) |
393216
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
FLASH
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.4 mm
|
|
| Speed |
300 MHz
|
|
| Supply Voltage-Max |
1.32 V
|
|
| Supply Voltage-Min |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| Date Of Intro |
|
2016-06-06
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
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