ATF750C-10PC
vs
ATF750C-10XU
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, PLASTIC, MS-001AF, DIP-24
|
4.40 MM, GREEN, PLASTIC, MO-153AD, TSSOP-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NO
|
NO
|
| Clock Frequency-Max |
83 MHz
|
83 MHz
|
| In-System Programmable |
NO
|
NO
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
|
| JTAG BST |
NO
|
NO
|
| Length |
31.877 mm
|
7.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Dedicated Inputs |
11
|
11
|
| Number of I/O Lines |
10
|
10
|
| Number of Macro Cells |
10
|
10
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
11 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP24,.3
|
TSSOP24,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.334 mm
|
1.2 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ATF750C-10PC with alternatives
Compare ATF750C-10XU with alternatives