ATECC608B-MAHDA-T
vs
ATECC608B-MAVDA-T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
UDFN-8
|
UDFN-8
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
8 Weeks
|
8 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Bus Compatibility |
I2C
|
I2C
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.12,20
|
SOLCC8,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
2 mm
|
uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
CRYPTOGRAPHIC AUTHENTICATOR
|
Base Number Matches |
1
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ATECC608B-MAHDA-T with alternatives
Compare ATECC608B-MAVDA-T with alternatives