ATECC608B-MAHDA-T
vs
ATECC608A-W07DA-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
UDFN-8
DIE, WAFER
Reach Compliance Code
compliant
compliant
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Microchip
Bus Compatibility
I2C
I2C
JESD-30 Code
R-PDSO-N8
R-XUUC-N
JESD-609 Code
e4
Length
3 mm
Moisture Sensitivity Level
1
Number of Terminals
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
DIE
Package Equivalence Code
SOLCC8,.12,20
WAFER
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.6 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
DUAL
UNSPECIFIED
Width
2 mm
uPs/uCs/Peripheral ICs Type
CRYPTOGRAPHIC AUTHENTICATOR
CRYPTOGRAPHIC AUTHENTICATOR
Base Number Matches
1
1
ECCN Code
5A992.C
HTS Code
8542.39.00.01
Date Of Intro
2018-10-04
Clock Frequency-Max
1 MHz
Screening Level
TS 16949
Compare ATECC608B-MAHDA-T with alternatives
Compare ATECC608A-W07DA-T with alternatives