ATA663255-GBQW vs TLE6260GP feature comparison

ATA663255-GBQW Microchip Technology Inc

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TLE6260GP Infineon Technologies AG

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INFINEON TECHNOLOGIES AG
Reach Compliance Code compliant not_compliant
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Samacsys Manufacturer Microchip
JESD-30 Code S-PDSO-N8 R-PDSO-G36
JESD-609 Code e3 e0
Length 3 mm 15.9 mm
Number of Functions 1 1
Number of Terminals 8 36
Number of Transceivers 1 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HSSOP
Package Equivalence Code SOLCC8,.12,25 SSOP36,.56
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Screening Level AEC-Q100
Seated Height-Max 1 mm 3.5 mm
Supply Current-Max 0.95 mA
Supply Voltage-Nom 13.5 V 13.5 V
Surface Mount YES YES
Telecom IC Type LIN TRANSCEIVER INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3 mm 11 mm
Base Number Matches 1 1
Part Package Code SOIC
Package Description HSSOP, SSOP36,.56
Pin Count 36
Data Rate 125 Mbps
Qualification Status Not Qualified
Technology CMOS

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