ATA663255-GBQW
vs
TLE6260GP
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G36
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
15.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
36
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HSSOP
|
Package Equivalence Code |
SOLCC8,.12,25
|
SSOP36,.56
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
3.5 mm
|
Supply Current-Max |
0.95 mA
|
|
Supply Voltage-Nom |
13.5 V
|
13.5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Package Description |
|
HSSOP, SSOP36,.56
|
Pin Count |
|
36
|
Data Rate |
|
125 Mbps
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
|
|
|
Compare ATA663255-GBQW with alternatives
Compare TLE6260GP with alternatives