TLE6260GP
vs
SN65HVDA100QDRQ1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
HSSOP, SSOP36,.56
|
SOIC-8
|
| Pin Count |
36
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
125 Mbps
|
20 Mbps
|
| JESD-30 Code |
R-PDSO-G36
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
15.9 mm
|
4.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
8
|
| Number of Transceivers |
1
|
1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
SOP
|
| Package Equivalence Code |
SSOP36,.56
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.5 mm
|
1.75 mm
|
| Supply Voltage-Nom |
13.5 V
|
14 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
LIN TRANSCEIVER
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
11 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Moisture Sensitivity Level |
|
2
|
| Number of Channels |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
0.775 mA
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TLE6260GP with alternatives
Compare SN65HVDA100QDRQ1 with alternatives