AT52BR3244T-85CI
vs
AT52BR1664AT-90CI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
Package Description
TFBGA, BGA66,8X12,32
10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PICTH, CBGA-66
Pin Count
66
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
85 ns
Additional Feature
SRAM IS ORGANISED AS 256K X 16
SRAM IS ORGANISED AS 256K X 16
JESD-30 Code
R-PBGA-B66
R-PBGA-B66
JESD-609 Code
e0
e0
Length
11 mm
10 mm
Memory Density
33554432 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA66,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.000002 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
2
2
Compare AT52BR3244T-85CI with alternatives
Compare AT52BR1664AT-90CI with alternatives