AT27LV256R-30JI
vs
AM29F002NT-55PCB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SPANSION INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.51
|
| Access Time-Max |
270 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-PDIP-T32
|
| JESD-609 Code |
e0
|
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
OTP ROM
|
FLASH
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Terminals |
32
|
32
|
| Number of Words |
32768 words
|
|
| Number of Words Code |
32000
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC32,.5X.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Programming Voltage |
13 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.025 mA
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Package Description |
|
,
|
| Pin Count |
|
32
|
| Additional Feature |
|
TOP BOOT BLOCK
|
| Boot Block |
|
TOP
|
| Type |
|
NOR TYPE
|
|
|
|
Compare AT27LV256R-30JI with alternatives
Compare AM29F002NT-55PCB with alternatives