AT27C256R-15TI vs AM27C64-255DI feature comparison

AT27C256R-15TI Atmel Corporation

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AM27C64-255DI Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer ATMEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code TSOP
Package Description PLASTIC, TSOP-28 WINDOWED, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 150 ns 250 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G28 R-CDIP-T28
JESD-609 Code e0
Length 11.8 mm
Memory Density 262144 bit 65536 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 8192 words
Number of Words Code 32000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 8KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP1 DIP
Package Equivalence Code TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 13 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.55 mm
Terminal Position DUAL DUAL
Width 8 mm
Base Number Matches 2 2

Compare AT27C256R-15TI with alternatives

Compare AM27C64-255DI with alternatives