AT27C256R-15TI
vs
AM27C64-255DI
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
ATMEL CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
TSOP
Package Description
PLASTIC, TSOP-28
WINDOWED, CERAMIC, DIP-28
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
150 ns
250 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
R-CDIP-T28
JESD-609 Code
e0
Length
11.8 mm
Memory Density
262144 bit
65536 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
8192 words
Number of Words Code
32000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP1
DIP
Package Equivalence Code
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
13 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.55 mm
Terminal Position
DUAL
DUAL
Width
8 mm
Base Number Matches
2
2
Compare AT27C256R-15TI with alternatives
Compare AM27C64-255DI with alternatives