AT27C1024L-20PI
vs
M27C1024-70XF6
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Package Description
0.600 INCH, PLASTIC, DIP-40
WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
200 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T40
R-GDIP-T40
JESD-609 Code
e0
e3
Length
52.2 mm
52.195 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.59 mm
5.97 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.04 mA
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
40
Compare AT27C1024L-20PI with alternatives
Compare M27C1024-70XF6 with alternatives