AT21CS01-UHM10-B
vs
AT21CS01-MSHM15-T
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VFBGA,
|
XSFN-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Date Of Intro |
2017-10-09
|
2017-10-09
|
| JESD-30 Code |
R-PBGA-B4
|
R-XDSO-N2
|
| Memory Density |
1024 bit
|
1024 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
2
|
| Number of Words |
128 words
|
128 words
|
| Number of Words Code |
128
|
128
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128X8
|
128X8
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Screening Level |
ISO/TS-16949
|
TS 16949
|
| Seated Height-Max |
0.355 mm
|
0.4 mm
|
| Serial Bus Type |
1-WIRE
|
1-WIRE
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
2 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
1
|
1
|
| Data Retention Time-Min |
|
100
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| Length |
|
5 mm
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Package Equivalence Code |
|
SURF MNT 2,.14X.2
|
| Standby Current-Max |
|
0.0000025 A
|
| Supply Current-Max |
|
0.0005 mA
|
| Width |
|
3.5 mm
|
|
|
|
Compare AT21CS01-UHM10-B with alternatives
Compare AT21CS01-MSHM15-T with alternatives