AT21CS01-MSHM15-T
vs
AT21CS01-UHM0B-T
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
XSFN-2
|
VFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2017-10-09
|
2017-10-09
|
Data Retention Time-Min |
100
|
|
Endurance |
1000000 Write/Erase Cycles
|
|
JESD-30 Code |
R-XDSO-N2
|
R-PBGA-B4
|
Length |
5 mm
|
|
Memory Density |
1024 bit
|
1024 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
2
|
4
|
Number of Words |
128 words
|
128 words
|
Number of Words Code |
128
|
128
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128X8
|
128X8
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
VFBGA
|
Package Equivalence Code |
SURF MNT 2,.14X.2
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Screening Level |
TS 16949
|
ISO/TS-16949
|
Seated Height-Max |
0.4 mm
|
0.355 mm
|
Serial Bus Type |
1-WIRE
|
1-WIRE
|
Standby Current-Max |
0.0000025 A
|
|
Supply Current-Max |
0.0005 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
2 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Width |
3.5 mm
|
|
Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
Base Number Matches |
1
|
1
|
|
|
|
Compare AT21CS01-MSHM15-T with alternatives
Compare AT21CS01-UHM0B-T with alternatives