ASM3P5812A-ST vs ASM3I2812AF-08TR feature comparison

ASM3P5812A-ST Alliance Semiconductor Corporation

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ASM3I2812AF-08TR Alliance Semiconductor Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP ALLIANCE SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, TSSOP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.92 mm 4.4 mm
Number of Terminals 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Clock Frequency-Max 40 MHz 80 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Primary Clock/Crystal Frequency-Nom 20 MHz 40 MHz
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.1 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.95 mm 3 mm
uPs/uCs/Peripheral ICs Type CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER
Base Number Matches 2 2
Rohs Code Yes
JESD-609 Code e3/e6
Peak Reflow Temperature (Cel) 260
Terminal Finish PURE MATTE TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) 40

Compare ASM3P5812A-ST with alternatives

Compare ASM3I2812AF-08TR with alternatives