AS9C25256M2036L-250BI
vs
IDT70T651S10BCI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA, BGA256,16X16,40
Pin Count
256
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
10 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
17 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
256
256
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX36
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.5 mm
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
2
1
I/O Type
COMMON
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA256,16X16,40
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.02 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.445 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare AS9C25256M2036L-250BI with alternatives
Compare IDT70T651S10BCI8 with alternatives