AS9C25256M2036L-250BI vs AS9C25256M2036L-200BC feature comparison

AS9C25256M2036L-250BI Integrated Silicon Solution Inc

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AS9C25256M2036L-200BC Alliance Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ALLIANCE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 7.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 256 256
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX36 256KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 2 2

Compare AS9C25256M2036L-250BI with alternatives

Compare AS9C25256M2036L-200BC with alternatives