AS8C401801-QC166N vs IDT71V3558S166PF9 feature comparison

AS8C401801-QC166N Alliance Memory Inc

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IDT71V3558S166PF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LQFP, PLASTIC, TQFP-100
Pin Count 100 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Samacsys Manufacturer Alliance Memory
Access Time-Max 3.5 ns 3.5 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
Length 20 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 2 1
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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