AS7C3512K18P-4TQC vs IDT71V65703S80B feature comparison

AS7C3512K18P-4TQC Alliance Semiconductor Corporation

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IDT71V65703S80B Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP BGA
Package Description QFP, QFP100,.63X.87 14 X 22 MM, PLASTIC, MS-026AA, BGA-119
Pin Count 100 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4 ns 8 ns
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e0 e0
Memory Density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 256KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position QUAD BOTTOM
Base Number Matches 1 1
Additional Feature FLOW-THROUGH ARCHITECTURE
Length 22 mm
Seated Height-Max 2.36 mm
Width 14 mm

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Compare IDT71V65703S80B with alternatives