AS7C33256NTD32A-166BI vs MT58L256V32PB-10 feature comparison

AS7C33256NTD32A-166BI Alliance Semiconductor Corporation

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MT58L256V32PB-10 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 BGA,
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 9 ns 5 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX32 256KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.475 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 2
Additional Feature AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE

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