AS7C33256NTD32A-166BI vs MT58L256L32FB-8.8 feature comparison

AS7C33256NTD32A-166BI Alliance Semiconductor Corporation

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MT58L256L32FB-8.8 Micron Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 14 X 22 MM, BGA-119
Pin Count 119 119
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 9 ns 7.5 ns
Clock Frequency-Max (fCLK) 166 MHz 113 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX32 256KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Standby Current-Max 0.03 A 0.01 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.475 mA 0.28 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 2
Additional Feature AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE

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