AS7C33128NTD36A-200BC vs IS61QDP2B21M36A-300B4I feature comparison

AS7C33128NTD36A-200BC Alliance Semiconductor Corporation

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IS61QDP2B21M36A-300B4I Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP INTEGRATED SILICON SOLUTION INC
Part Package Code QFP BGA
Package Description LQFP, LBGA, BGA165,11X15,40
Pin Count 100 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 0.45 ns
JESD-30 Code R-PQFP-G100 R-PBGA-B165
Length 20 mm 15 mm
Memory Density 4718592 bit 37748736 bit
Memory IC Type ZBT SRAM QDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 131072 words 1048576 words
Number of Words Code 128000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.465 V 1.89 V
Supply Voltage-Min (Vsup) 3.135 V 1.71 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 1
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Standby Current-Max 0.28 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.1 mA

Compare AS7C33128NTD36A-200BC with alternatives

Compare IS61QDP2B21M36A-300B4I with alternatives