AS7C31025-20TI vs 8959836BZC feature comparison

AS7C31025-20TI Alliance Semiconductor Corporation

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8959836BZC Micross Components

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP AUSTIN SEMICONDUCTOR INC
Part Package Code TSOP2 DIP
Package Description TSOP2, TSOP32,.46 DIP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 35 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-CDIP-T32
JESD-609 Code e0 e4
Length 20.95 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP2 DIP
Package Equivalence Code TSOP32,.46
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 4.34 mm
Standby Current-Max 0.0005 A
Standby Voltage-Min 2 V
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 2 1
Number of Ports 1
Output Enable YES

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