8959836BZC
vs
MSM8128WX-55
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
MOSAIC SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
,
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
55 ns
JESD-30 Code
R-CDIP-T32
R-CQCC-N32
JESD-609 Code
e4
Length
40.64 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.34 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Width
10.16 mm
Base Number Matches
1
2
Compare 8959836BZC with alternatives
Compare MSM8128WX-55 with alternatives