AS7C251026LL-55BI vs HY62EF8100LLM-10I feature comparison

AS7C251026LL-55BI Alliance Semiconductor Corporation

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HY62EF8100LLM-10I SK Hynix Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP SK HYNIX INC
Part Package Code BGA BGA
Package Description BGA, BGA48,6X8,30 TFBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000005 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3 V 2.2 V
Supply Voltage-Min (Vsup) 2.3 V 1.8 V
Supply Voltage-Nom (Vsup) 2.5 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Length 6.5 mm
Seated Height-Max 1.11 mm
Width 6.2 mm

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