AS7C251024LL-100BC vs IS62UP6416SL-100HI feature comparison

AS7C251024LL-100BC Alliance Semiconductor Corporation

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IS62UP6416SL-100HI Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA TSOP2
Package Description BGA, BGA36,6X8,30 STSOP2-44
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 131072 words 65536 words
Number of Words Code 128000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TSOP2
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000005 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3 V 3.3 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 2.5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Base Number Matches 1 1
Pbfree Code No
Length 18.41 mm
Moisture Sensitivity Level 3
Seated Height-Max 1.2 mm
Width 10.16 mm

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Compare IS62UP6416SL-100HI with alternatives