AS7C251024LL-100BC vs HY62QF8100CSLF-I-70 feature comparison

AS7C251024LL-100BC Alliance Semiconductor Corporation

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HY62QF8100CSLF-I-70 SK Hynix Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP SK HYNIX INC
Part Package Code BGA BGA
Package Description BGA, BGA36,6X8,30 TFBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000005 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Length 6.3 mm
Seated Height-Max 1.1 mm
Width 6.2 mm

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Compare HY62QF8100CSLF-I-70 with alternatives