HY62QF8100CSLF-I-70 vs KM616FS1010AFI-7 feature comparison

HY62QF8100CSLF-I-70 SK Hynix Inc

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KM616FS1010AFI-7 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e0
Length 6.3 mm 7 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 65536 words
Number of Words Code 128000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6.2 mm 6 mm
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Voltage-Min 1 V
Supply Current-Max 0.03 mA

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